MICROLITHOGRAPHY PROCESS STEPS
Thermal Oxidation or Decomposition
- Silicon wafer is heated and exposed to oxygen forming a SiO2 film on the surface of the wafer
Masking(like stencils:create circuit patterns)
- Photoresist film is applied to wafer
- Mask is applied
- Intense light(UV) is projected through the mask
Etching(removal of select portions)
- Wafer is developed (exposed resist is removed)
- Wafer baked to harden remaining Photoresist pattern
- Wafer exposed to chemical solution so resist not hardened are etched away